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 ICX205AK
Diagonal 8mm (Type 1/2) Progressive Scan CCD Image Sensor with Square Pixel for Color Cameras
Description The ICX205AK is a diagonal 8mm (Type 1/2) interline CCD solid-state image sensor with a square pixel array and 1.45M effective pixels. Progressive scan allows all pixels' signals to be output independently within approximately 1/7.5 second. Also, the adoption of high frame rate readout mode supports 30 frames per second. This chip features an electronic shutter with variable charge-storage time which makes it possible to realize full-frame still image without a mechanical shutter. High resolution and high color reproductivity are achieved through the use of R, G, B primary color mosaic filters. Further, high sensitivity and low dark current are achieved through the adoption of HAD (HoleAccumulation Diode) sensors. This chip is suitable for applications such as electronic still cameras, PC input cameras, etc. Features * Progressive scan allows individual readout of the image signals from all pixels. * High horizontal and vertical resolution (both approx. 800TV-lines) still image without a mechanical shutter. * Supports high frame rate readout mode (effective 256 lines output, 30 frame/s) * Square pixel * Horizontal drive frequency: 14.318MHz * No voltage adjustments (reset gate and substrate bias are not adjusted.) * R, G, B primary color mosaic filters on chip * High resolution, high color reproductivity, high sensitivity, low dark current * Low smear, excellent antiblooming characteristics * Continuous variable-speed shutter Device Structure * Interline CCD image sensor * Image size: * Total number of pixels: * Number of effective pixels: * Number of active pixels: * Chip size: * Unit cell size: * Optical black: * Number of dummy bits: * Substrate material: 20 pin DIP (Cer-DIP)
Pin 1 2
V
8 2 Pin 11 H 40
Optical black position (Top View)
Diagonal 8mm (Type 1/2) 1434 (H) x 1050 (V) approx. 1.50M pixels 1392 (H) x 1040 (V) approx. 1.45M pixels 1360 (H) x 1024 (V) approx. 1.40M pixels (7.959mm diagonal) 7.60mm (H) x 6.20mm (V) 4.65m (H) x 4.65m (V) Horizontal (H) direction: Front 2 pixels, rear 40 pixels Vertical (V) direction: Front 8 pixels, rear 2 pixels Horizontal 20 Vertical 3 Silicon
Wfine CCD is a registered trademark of Sony Corporation. Represents a CCD adopting progressive scan, primary color filter and square pixel. Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
-1-
E98118B99
ICX205AK
VOUT
GND
GND
V2B
V2A
2
B G
Block Diagram and Pin Configuration (Top View)
NC
10 9 8
7
6
NC
5
V3
4
3
G
B G
G R
Vertical register
R
...
...
G R G R
...
B G B G
G R G R
...
B G B G
V1
1 Note)
NC
Note)
: Photo sensor
Horizontal register
11
12
13
14
15
16
17
18
19
20
CSUB
NC
SUB
GND
Pin Description Pin No. 1 2 3 4 5 6 7 8 9 10 Symbol V1 V2A V2B V3 NC NC GND NC GND VOUT GND Signal output GND Description Vertical register transfer clock Vertical register transfer clock Vertical register transfer clock Vertical register transfer clock Pin No. 11 12 13 14 15 16 17 18 19 20 Symbol VDD GND SUB NC CSUB NC VL RG H1 H2 Protective transistor bias Reset gate clock Horizontal register transfer clock Horizontal register transfer clock Substrate bias1 Description Supply voltage GND Substrate clock
1 DC bias is generated within the CCD, so that this pin should be grounded externally through a capacitance of 0.1F.
-2-
RG
VDD
H1
H2
NC
VL
ICX205AK
Absolute Maximum Ratings Item VDD, VOUT, RG - SUB V2A, V2B - SUB Against SUB V1, V3, VL - SUB H1, H2, GND - SUB CSUB - SUB VDD, VOUT, RG, CSUB - GND Against GND V1, V2A, V2B, V3 - GND H1, H2 - GND Against VL V2A, V2B - VL V1, V3, H1, H2, GND - VL Voltage difference between vertical clock input pins Between input clock pins H1 - H2 H1, H2 - V3 Storage temperature Operating temperature 1 +24V (Max.) when clock width < 10s, clock duty factor < 0.1%. +16V (Max.) is guaranteed for turning on or off power supply. Ratings -40 to +10 -50 to +15 -50 to +0.3 -40 to +0.3 -25 to -0.3 to +18 -10 to +18 -10 to +15 -0.3 to +28 -0.3 to +15 to +15 -16 to +16 -16 to +16 -30 to +80 -10 to +60 Unit Remarks V V V V V V V V V V V V V C C 1
-3-
ICX205AK
Bias Conditions Item Supply voltage Protective transistor bias Substrate clock Reset gate clock Symbol VDD VL SUB RG Min. 14.55 Typ. 15.0 1 2 2 Max. 15.45 Unit V Remarks
1 VL setting is the VVL voltage of the vertical transfer clock waveform, or the same power supply as the VL power supply for the V driver should be used. 2 Do not apply a DC bias to the substrate clock and reset gate clock pins, because a DC bias is generated within the CCD.
DC Characteristics Item Supply current Symbol IDD Min. Typ. 5.5 Max. Unit mA Remarks
Clock Voltage Conditions Item Readout clock voltage VVT VVH02A VVH1, VVH2A, VVH2B, VVH3 VVL1, VVL2A, VVL2B, VVL3 Vertical transfer clock voltage V1, V2A, V2B, V3 | VVL1 - VVL3 | VVHH VVHL VVLH VVLL Horizontal transfer clock voltage Reset gate clock voltage VH VHL VRG VRGLH - VRGLL VRGL - VRGLm Substrate clock voltage VSUB 22.15 23.0 4.75 -0.05 3.0 5.0 0 3.3 Symbol Min. 14.55 -0.05 -0.2 -8.4 7.6 Typ. 15.0 0 0 -8.0 8.0 Max. 15.45 0.05 0.05 -7.6 8.4 0.1 0.9 1.3 1.0 0.9 5.25 0.05 5.5 0.4 0.5 23.85 Unit V V V V V V V V V V V V V V V V Waveform diagram 1 2 2 2 2 2 2 2 2 2 3 3 4 4 4 5 Low-level coupling Low-level coupling High-level coupling High-level coupling Low-level coupling Low-level coupling VVL = (VVL1 + VVL3)/2 VVH = VVH02A Remarks
-4-
ICX205AK
Clock Equivalent Circuit Constant Item Symbol CV1 Capacitance between vertical transfer clock and GND CV2A CV2B CV3 CV12A, CV2B1 Capacitance between vertical transfer clocks CV2A3, CV32B CV13 Capacitance between horizontal transfer clock and GND Capacitance between horizontal transfer clocks Capacitance between reset gate clock and GND Capacitance between substrate clock and GND CH1, CH2 CHH CRG CSUB R1 Vertical transfer clock series resistor R2A, R3 R2B Vertical transfer clock ground resistor Horizontal transfer clock series resistor Reset gate clock series resistor RGND RH RRG Min. Typ. 2200 1800 6800 3300 1200 1200 2200 47 100 8 680 36 56 43 30 15 20 Max. Unit pF pF pF pF pF pF pF pF pF pF pF Remarks
V1
V2A
R1
CV12A
R2A RH H1 RH H2 CHH CV2A3 CV13 CH1 CH2
CV1 CV2B1
CV2A
CV2B RGND CV3 R2B CV32B R3
V2B
V3
Vertical transfer clock equivalent circuit
RRG RG
Horizontal transfer clock equivalent circuit
CRG
Reset gate clock equivalent circuit
-5-
ICX205AK
Drive Clock Waveform Conditions (1) Readout clock waveform
VT 100% 90%
II II
M M 2 0V
VVT 10% 0% tr twh tf
Note) Readout clock is used by composing vertical transfer clocks V2A and V2B.
(2) Vertical transfer clock waveform
V1 VVHL VVH1 VVHH VVH
VVLH VVL01 VVL1 VVLL V2A, V2B VVH02A, VVH02B VVHH VVHL VVH2A, VVH2B VVH VVL
VVLH VVL2A, VVL2B VVLL V3 VVHL VVH3 VVHH VVH VVL
VVL03 VVLL
VVLH
VVL
VVH = VVH02A VVL = (VVL01 + VVL03) / 2 VVL3 = VVL03
-6-
VV1 = VVH1 - VVL01 VV2A = VVH02A - VVL2A VV2B = VVH02B - VVL2B VV3 = VVH3 - VVL03
ICX205AK
(3) Horizontal transfer clock waveform
tr H2 90% VCR VH 10% H1 two VH 2 twl twh tf
VHL
Cross-point voltage for the H1 rising side of the horizontal transfer clocks H1 and H2 waveforms is VCR. The overlap period for twh and twl of horizontal transfer clocks H1 and H2 is two. (4) Reset gate clock waveform
tr twh tf
RG waveform
VRGH
twl VRG Point A VRGLH VRGLL VRGLm VRGL
VRGLH is the maximum value and VRGLL is the minimum value of the coupling waveform during the period from Point A in the above diagram until the rising edge of RG. In addition, VRGL is the average value of VRGLH and VRGLL. VRGL = (VRGLH + VRGLL)/2 Assuming VRGH is the minimum value during the interval twh, then: VRG = VRGH - VRGL. Negative overshoot level during the falling edge of RG is VRGLm. (5) Substrate clock waveform
100% 90%
M VSUB 10% VSUB 0% (A bias generated within the CCD) M 2 tf
tr
twh
-7-
ICX205AK
Clock Switching Characteristics Item Readout clock Vertical transfer clock
Horizontal transfer clock
Symbol VT V1, V2A, V2B, V3 H1 H2 20 20
twh
twl
tr
tf
Unit
Remarks
Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. 2.3 2.5 0.5 15 25 25 20 20 25 25 10 10 0.01 0.01 11 13 2.2 51 3 0.5 15 15 10 10 0.01 0.01 3 0.5 s During readout 450 ns 15 15 ns 1 2
During imaging
During H1 parallel-serial H2 conversion RG SUB
s ns 0.5 s During drain charge
Reset gate clock Substrate clock
1 When vertical transfer clock driver CXD1267AN x 2 is used. 2 tf tr - 2ns, and the cross-point voltage (VCR) for the H1 rising side of the H1 and H2 waveforms must be at least VH/2 [V].
Item Horizontal transfer clock
Symbol H1, H2 16
two Min. Typ. Max. 20
Unit ns
Remarks
Spectral Sensitivity Characteristics (excludes lens characteristics and light source characteristics)
1
G 0.8 B
R
Relative Response
0.6
0.4
0.2
0 400
500 Wave Length [nm]
600
700
-8-
ICX205AK
Image Sensor Characteristics Item G sensitivity Sensitivity comparison Saturation signal Smear Video signal shading Uniformity between video signal channels Dark signal Dark signal shading Line crawl G Line crawl R Line crawl B Lag R B Symbol Sg Rr Rb Vsat Sm SHg Srg Sbg Vdt Vdt Lcg Lcr Lcb Lag Min. 320 0.4 0.3 450 0.001 0.0025 20 25 8 8 16 4 3.8 3.8 3.8 0.5 Typ. 400 0.55 0.45 0.7 0.6 mV % % % % % mV mV % % % % Max. Unit mV Measurement method 1 1 1 2 3 4 4 5 5 6 7 8 8 8 9 Ta = 60C Ta = 60C Ta = 60C
(Ta = 25C) Remarks 1/30s accumulation
No electronic shutter Zone 0 and I Zone 0 to II'
Zone Definition of Video Signal Shading
1392 (H) 16 16 8 H 8 V 10 H 8
1040 (V)
Zone 0, I Zone II, II' V 10
8
Ignored region Effective pixel region
Measurement System
CCD signal output [A] Gr/Gb CCD C.D.S AMP S/H R/B S/H R/B channel signal output [C] Gr/Gb channel signal output [B]
Note) Adjust the amplifier gain so that the gain between [A] and [B], and between [A] and [C] equals 1. -9-
ICX205AK
Image Sensor Characteristics Measurement Method Color coding and readout of this image sensor Gb R Gb R B Gr B Gr Gb R Gb R B Gr B Gr The primary color filters of this image sensor are arranged in the layout shown in the figure on the left (Bayer arrangement). Gr and Gb denote the G signals on the same line as the R signal and the B signal, respectively.
Horizontal register Color Coding Diagram All pixel signals are output successively in a 1/7.5s period. The R signal and Gr signal lines and the Gb signal and B signal lines are output successively.
- 10 -
ICX205AK
Readout modes The diagram below shows the output methods for the following two readout modes. Progressive scan mode
16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 VOUT G R G R G R G R G R G R G R G R B G B G B G B G B G B G B G B G VOUT
High frame rate readout mode
16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 G R G R G R G R G R G R G R G R B G B G B G B G B G B G B G B G
Note) Blacked out portions in the diagram indicate pixels which are not read out. Output starts from the line 1 in high frame rate readout mode.
1. Progressive scan mode In this mode, all pixel signals are output in non-interlace format in 1/7.5s. The vertical resolution is approximately 800TV-lines and all pixel signals within the same exposure period are read out simultaneously, making this mode suitable for high resolution image capturing. 2. High frame rate readout mode All effective areas are scanned in approximately 1/30s by reading out two out of eight lines (1st and 4th lines, 9th and 12th lines). The vertical resolution is approximately 200TV-lines. This readout mode emphasizes processing speed over vertical resolution. - 11 -
ICX205AK
Measurement conditions 1) In the following measurements, the device drive conditions are at the typical values of the progressive scan mode, bias and clock voltage conditions. 2) In the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical black level (OB) is used as the reference for the signal output, which is taken as the value of the Gr/Gb signal output or the R/B signal output of the measurement system. Definition of standard imaging conditions 1) Standard imaging condition I: Use a pattern box (luminance: 706cd/m2, color temperature of 3200K halogen source) as a subject. (Pattern for evaluation is not applicable.) Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter and image at F5.6. The luminous intensity to the sensor receiving surface at this point is defined as the standard sensitivity testing luminous intensity. 2) Standard imaging condition II: Image a light source (color temperature of 3200K) with a uniformity of brightness within 2% at all angles. Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter. The luminous intensity is adjusted to the value indicated in each testing item by the lens diaphragm. 1. G sensitivity, sensitivity comparison Set to standard imaging condition I. After selecting the electronic shutter mode with a shutter speed of 1/100s, measure the signal outputs (VGr, VGb, VR and VB) at the center of each Gr, Gb, R and B channel screen, and substitute the values into the following formulas. VG = (VGr + VGb)/2 Sg = VG x 100/30 [mV] Rr = VR/VG Rb = VB/VG 2. Saturation signal Set to standard imaging condition II. After adjusting the luminous intensity to 20 times the intensity with the average value of the Gr signal output, 150mV, measure the minimum values of the Gr, Gb, R and B signal outputs. 3. Smear Set to standard imaging condition II. With the lens diaphragm at F5.6 to F8, first adjust the average value of the Gr signal output to 150mV. Measure the average values of the Gr signal output, Gb signal output, R signal output and B signal output (Gra, Gba, Ra, Ba), and then adjust the luminous intensity to 500 times the intensity with the average value of the Gr signal output, 150mV. After the readout clock is stopped and the charge drain is executed by the electronic shutter at the respective H blankings, measure the maximum value (VSm [mV]) independent of the Gr, Gb, R and B signal outputs, and substitute the values into the following formula. Sm = Vsm / Gra + Gba + Ra + Ba 4 x 1 1 x x 100 [%] (1/10V method conversion value) 10 500
4. Video signal shading Set to standard imaging condition II. With the lens diaphragm at F5.6 to F8, adjust the luminous intensity so that the average value of the Gr signal output is 150mV. Then measure the maximum (Grmax [mV]) and minimum (Grmin [mV]) values of the Gr signal output and substitute the values into the following formula. SHg = (Grmax - Grmin)/150 x 100 [%] - 12 -
ICX205AK
5. Uniformity between video signal channels After measuring 4, measure the maximum (Rmax [mV]) and minimum (Rmin [mV]) values of the R signal and the maximum (Bmax [mV]) and minimum (Bmin [mV]) values of the B signal, and substitute the values into the following formulas. Srg = (Rmax - Rmin)/150 x 100 [%] Sbg = (Bmax - Bmin)/150 x 100 [%] 6. Dark signal Measure the average value of the signal output (Vdt [mV]) with the device ambient temperature 60C and the device in the light-obstructed state, using the horizontal idle transfer level as a reference. 7. Dark signal shading After measuring 6, measure the maximum (Vdmax [mV]) and minimum (Vdmin [mV]) values of the dark signal output and substitute the values into the following formula. Vdt = Vdmax - Vdmin [mV] 8. Line crawl Set to standard imaging condition II. Adjusting the luminous intensity so that the average value of the Gr signal output is 150mV, and then insert R, G and B filters and measure the difference between G signal lines (Glr, Glg, Glb [mV]) as well as the average value of the G signal output (Gar, Gag, Gab). Substitute the values into the following formula. Lci = Gli/Gai x 100 [%] (i = r, g, b) 9. Lag Adjust the Gr signal output value generated by strobe light to 150mV. After setting the strobe light so that it strobes with the following timing, measure the residual signal (Vlag). Substitute the value into the following formula. Lag = (Vlag/150) x 100 [%]
VD
V2A Light Strobe light Timing Gr signal output 150mV Vlag (lag)
Output
- 13 -
Drive Circuit
15V
-8.0V
100
XV1 XV2A XSG1
CXD1267AN
1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11
2SK523
1 2 3 4 5 6 7 8 9 10
CCD OUT
V1 V2A V2B V3 NC NC GND NC GND VOUT
100k 1/35V
20 19 18 17 16 15 14 13 12 11
H2 H1 RG VL NC CSUB NC SUB GND VDD
- 14 -
20 19 18 17 16 15 14 13 12 11 22/16V 0.1 0.1
3.9k ICX205 (Bottom View)
0.1
22/20V
0.01
XSUB XV3 XV2B XSG2
1 2 3 4 5 6 7 8 9 10
CXD1267AN
2200P 1M
22/20V
H2
H1
ICX205AK
RG
Sensor Readout Clock Timing Chart
Progressive Scan Mode
XV1
XV2A/XV2B
XV3
XSG1/XSG2
Sensor readout clocks XSG1 and XSG2 are used by composing XV2A and XV2B.
- 15 -
139ns (2 bits) 3.49s (50 bits) 55.8s (800 bits)
HD
V1
V2A/V2B
V3
ICX205AK
Sensor Readout Clock Timing Chart
High Frame Rate Readout Mode
XV1
XV2A/XV2B
XV3
XSG1
XSG2 Sensor readout clock XSG1 is used by composing XV2A.
- 16 -
139ns (2 bits) 55.8s (800 bits) 3.49s (50 bits) 5.0s (72 bits)
HD
5.87s (84 bits)
V1
V2A
V2B
V3
14 bits
ICX205AK
14 bits
Drive Timing Chart (Vertical Sync)
Progressive Scan Mode
VD
HD
3 4 7 11 12 2 5 6 1052 1068 1 9 10 8 13 21 1044 1063
1063
V1
V2A
V2B
V3
CCD OUT
1040
1038 1039 1040
1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 9 10
1068 1
- 17 -
1234 56 78 1 2345
ICX205AK
Drive Timing Chart (Vertical Sync)
High Frame Rate Readout Mode
1/30s
1/30s
VD
V1
V2A
V2B
V3
266 267 1 2 3 4 5 6 7 8
CCD OUT
1020 1025 1028 1033 1036
1020 1025 1028 1033 1036
1 4 1 4 9 12 17 20 25
1 4 1 4 9 12 17 20 25
260 261 262 263 264 265 266 267 1 2 3 4 5 6 7 8
HD
- 18 -
1 4 1 4 9 12 17 20 25
ICX205AK
Drive Timing Chart (Horizontal Sync)
Progressive Scan Mode
HD 96
1
2
392 412 430
16
CLK
H1
H2
- 19 -
96 1 1 96 1 96 1 1 64 1 96 1 96 1 64 1
V1
1790 1
56
1
240
1
32 208
V2A
1
32 208
V2B
V3
1
176
SUB
1
176
RG
ICX205AK
Drive Timing Chart (Horizontal Sync)
High Frame Rate Readout Mode
HD
1 96
2
392 412 430
1790 1
CLK
H1
H2 42 1 1 1 1 42 1 1 1 1 42 1 1 1 1 168 42 42 42 42 1 1 42 42 42 1 42 112 1 56 42 1 42 1 1 42 42 1 14 42 1 1 42 1 42 1 42 42 1 42 1 42 42 42 42 42 1 42 1 28
16
56
1
1
42 1 1 42 28
- 20 -
V1
1 14
V2A
1
1 14
V2B
1
V3
1
28
SUB
1
RG
ICX205AK
ICX205AK
Notes on Handling 1) Static charge prevention CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following protective measures. a) Either handle bare handed or use non-chargeable gloves, clothes or material. Also use conductive shoes. b) When handling directly use an earth band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) Ionized air is recommended for discharge when handling CCD image sensor. e) For the shipment of mounted substrates, use boxes treated for the prevention of static charges. 2) Soldering a) Make sure the package temperature does not exceed 80C. b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a ground 30W soldering iron and solder each pin in less than 2 seconds. For repairs and remount, cool sufficiently. c) To dismount an image sensor, do not use a solder suction equipment. When using an electric desoldering tool, use a thermal controller of the zero cross On/Off type and connect it to ground. 3) Dust and dirt protection Image sensors are packed and delivered by taking care of protecting its glass plates from harmful dust and dirt. Clean glass plates with the following operation as required, and use them. a) Perform all assembly operations in a clean room (class 1000 or less). b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized air is recommended.) c) Clean with a cotton bud and ethyl alcohol if the grease stained. Be careful not to scratch the glass. d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when moving to a room with great temperature differences. e) When a protective tape is applied before shipping, just before use remove the tape applied for electrostatic protection. Do not reuse the tape. 4) Installing (attaching) a) Remain within the following limits when applying a static load to the package. Do not apply any load more than 0.7mm inside the outer perimeter of the glass portion, and do not apply any load or impact to limited portions. (This may cause cracks in the package.)
Upper ceramic
39N
29N
29N
0.9Nm
Lower ceramic
Low melting point glass Shearing strength Tensile strength Torsional strength
Compressive strength
- 21 -
ICX205AK
b) If a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the ceramic portions. Therefore, for installation, use either an elastic load, such as a spring plate, or an adhesive. c) The adhesive may cause the marking on the rear surface to disappear, especially in case the regulated voltage value is indicated on the rear surface. Therefore, the adhesive should not be applied to this area, and indicated values should be transferred to other locations as a precaution. d) The upper and lower ceramic are joined by low melting point glass. Therefore, care should be taken not to perform the following actions as this may cause cracks. * Applying repeated bending stress to the outer leads. * Heating the outer leads for an extended period with a soldering iron. * Rapidly cooling or heating the package. * Applying any load or impact to a limited portion of the low melting point glass using tweezers or other sharp tools. * Prying at the upper or lower ceramic using the low melting point glass as a fulcrum. Note that the same cautions also apply when removing soldered products from boards. e) Acrylate anaerobic adhesives are generally used to attach CCD image sensors. In addition, cyanoacrylate instantaneous adhesives are sometimes used jointly with acrylate anaerobic adhesives. (reference) 5) Others a) Do not expose to strong light (sun rays) for long periods, color filters will be discolored. When high luminance objects are imaged with the exposure level control by electronic-iris, the luminance of the image-plane may become excessive and discolor of the color filter will possibly be accelerated. In such a case, it is advisable that taking-lens with the automatic-iris and closing of the shutter during the power-off mode should be properly arranged. For continuous using under cruel condition exceeding the normal using condition, consult our company. b) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or usage in such conditions.
- 22 -
Package Outline
Unit: mm
20pin DIP (600mil)
0 to 9
9.0 11 (R0.7) 1.4 11 20 A (1.0) (1.7)
0.7
20
~
3
C
15.24
1.4
11.55
~
3
7.55
V H
15.1 0.3
0.55
B'
0.4
0.83
1.27
1.778
4.0 0.3
0.4 0.8 0.3
M
PACKAGE STRUCTURE
PACKAGE MATERIAL
Cer-DIP
LEAD TREATMENT
TIN PLATING
LEAD MATERIAL
42 ALLOY
ICX205AK
PACKAGE WEIGHT
2.6g
~
- 23 -
0.7
0.46
3.4 0.3
14.6
3
1. "A" is the center of the effective image area. 2. The two points "B" of the package are the horizontal reference. The point "B'" of the package is the vertical reference. 3. The bottom "C" of the package is the height reference. 4. The center of the effective image area, relative to "B" and "B'" is (H, V) = (9.0, 7.55) 0.15mm. 5. The rotation angle of the effective image area relative to H and V is 1. 6. The height from the bottom "C" to the effective image area is 1.41 0.15mm. 7. The tilt of the effective image area relative to the bottom "C" is less than 60m. 8. The thickness of the cover glass is 0.75mm, and the refractive index is 1.5. 9. The notch and the hole on the bottom must not be used for reference of fixing.
0.25
1 18.0 0.4 17.6
10 10
1
(4.0)
B


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